Automation index
How much of a Packaging engineer’s job can AI already do?
A 3D prototype comes earlier. Surviving transport and opening on the shelf do not.
This percentage does not predict how many people will lose their jobs.
Task comparison
IS WORK OVER?
Packaging engineer
27%
AI can already do 27% of this job.
#161 / 623
View rankingPackaging engineer
Where the time goes
Task weights are our estimates based on O*NET frequency data, not time shares published by O*NET.
The time saving for each task is estimated separately.
| Task | Share | AI | Points |
|---|---|---|---|
Spec, 3D and the drop test.EstimateNo public source provides a precise figure. This is our estimate. | 18% | 48% | +8.6 |
The packing line and the one that will not fit.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 22% | +3.5 |
Material, recyclability and unit cost.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 36% | +5.8 |
Supplier, die and pack colour.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 28% | +4.5 |
Marketing, legal and not lying on the pack.EstimateNo public source provides a precise figure. This is our estimate. | 18% | 14% | +2.5 |
That it survives the trip, and not oversizing the plastic.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 12% | +1.9 |
| Total | 100% | 27% |
Modelled workweek: 100% · Public evidence: 0% · Estimate: 100% · Confidence: Low
Skills and activities
- design packs
- drop test
- packing line
- recyclability
- die-cut
- unit cost
- pack spec
- 3D prototype
Sources for this job· O*NET 17-2112.00· ESCO/ISCO 2141
IS WORK OVER?
Electronics engineer
25%
#237 / 623
View rankingElectronics engineer
Where the time goes
Task weights are our estimates based on O*NET frequency data, not time shares published by O*NET.
The time saving for each task is estimated separately.
| Task | Share | AI | Points |
|---|---|---|---|
Schematic, simulation and PCB layout.EstimateNo public source provides a precise figure. This is our estimate. | 18% | 48% | +8.6 |
Firmware, tests and bench.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 32% | +5.1 |
Vendors, prototypes and certifications.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 22% | +3.5 |
Debug EMC and field faults.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 18% | +2.9 |
Documentation, versioning and quality.EstimateNo public source provides a precise figure. This is our estimate. | 18% | 16% | +2.9 |
Not sending a blind board to manufacture.EstimateNo public source provides a precise figure. This is our estimate. | 16% | 14% | +2.2 |
| Total | 100% | 25% |
Modelled workweek: 100% · Public evidence: 0% · Estimate: 100% · Confidence: Low
Skills and activities
- Schematic, simulation and PCB layout
- Firmware, tests and bench
- Vendors, prototypes and certifications
- Debug EMC and field faults
- Documentation, versioning and quality
- Not sending a blind board to manufacture
- ingeniero electronico
- electronics engineer
Sources for this job· O*NET 17-2072.00· ESCO/ISCO 2152